Ipc-7093a Pdf May 2026

IPC-7093A is the current industry standard for the Design and Assembly Process Implementation for Bottom Termination Components (BTCs). Formally released in October 2020, this "Revision A" is a complete overhaul of the original 2011 standard, providing critical guidance for modern leadless packages such as QFNs, LGAs, and DFNs. Why IPC-7093A is Essential for Modern Electronics

• Class 1 & 2 (General/Service Electronics): Voids up to 30% of the pad area are acceptable.
• Class 3 (High Performance/Military): Voids limited to 20% (or even 10% for thermal pads under the die).
• Critical thermal voids: Any void covering more than 50% of the thermal pad is a reliability risk.

Inspection and Quality Control: Techniques for evaluating solder joints that are hidden beneath the package, specifically the use of Automated X-ray Inspection (AXI). ipc-7093a pdf

| Role | Why They Need IPC-7093A | | --- | --- | | PCB Design Engineer | To create land patterns that are manufacturable and reliable | | Process Engineer | To set up stencil printing, placement, and reflow profiles for BTCs | | Quality Control Manager | To define acceptance criteria for X-ray and visual inspection | | Sourcing/Procurement | To specify BTC suppliers that comply with industry design rules | | Rework Technician | To follow validated procedures for removing and replacing BTCs | IPC-7093A is the current industry standard for the

Material and Performance Requirements:

• Segmentation of the thermal pad into multiple smaller apertures (e.g., 4, 6, or 9 squares) to control voiding
• Aperture area ratios and aspect ratios
• Recommended solder paste types (Type 3, Type 4, or Type 5)

Understanding IPC-7093A: The Standard for Bottom Termination Components (BTCs) Class 1 & 2 (General/Service Electronics): Voids up